Master or above in semiconductor physics.

Knowledge of Semiconductor physics, device simulation, layout design.

Good command of English and PC operation, good communication skill and team player.

Response for establishment, characterization and validation of ESD device library,

ESD device structures and ESD design rules/files.

Provide technical support on design quality, ESD protection devices to design engineer and layout engineer.

Master in Microelectronics/Electronics fields.

Good command of English and PC operation, good communication skill and team player.

Test program and hardware maintenance

Wafer sort line support

Abnormal yield analysis

Testing efficiency improvement

Master in Microelectronics/Electronics fields.

Good command of English and PC operation, good communication skill and team player.

Set up, implement and evaluate related Test plan issue.

Arrange Reliability Test (Burn in/ Package Qual./ESD/Latch etc.)

Characterization for the results of CP test and FT test.

Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).

Handle PDR/NCR on time.

Master or above in Microelectronics/Electronics fields.

Teamwork spirit and good communication skills in both Chinese and English.

Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.

Work with project leaders to complete the project accurately and timely and coordinate with other departments related to analog IC development.

Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.

Master or above in EE, Power Electronics preferred.

Knowledge of circuit design tools, such as PCB layout (Cadence/OrCad), circuit simulation (Pspice, SIMPLIS, Saber), and mathematics analysis (Mathcad).

Good command of both Chinese and English.

Evaluate the engineering samples of new products based on the IC level and the power system level.

Perform definition, promotion of new power IC.

Prepare technical materials, demo prototypes, devices simulation model and total system solutions of power IC.

Work with FAE to solve power system application related issues in end customer side.

Continuously improve individual technical capability and maintain a solid understanding of power system application of end customers and competitors.

Master or above in Microelectronics-related fields with knowledge of IC design and semiconductor device physics.

Teamwork spirit and good communication skills in both Chinese and English.

Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.

Work with project leaders to complete the project accurately and timely and coordinate with other departments related to IC development.

Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.